Features:
- Maintains a Strong Bond Under Expansion, Contraction, and Limited Movement: Our 3M™ Scotch-Weld™ Epoxy Adhesive 2216 is designed for applications where high performance and flexible bonds are required. Its flexibility makes it ideal for applications involving dissimilar surfaces and where differing coefficients of thermal expansion are a consideration. Once fully cured the epoxy maintains an extremely strong bond under expansion, contraction and limited movement while also maintaining a good retention of strength over time and after environmental aging. With a 2:3 mix ratio it is a low viscosity epoxy. It flows smoothly for accurate dispensing. Both the base and accelerator are coded in contrasting colors to ensure you know which half of the product you are using
- Excellent for Cryogenic Bonding Applications: We've designed the 3M™ Scotch-Weld™ Epoxy Adhesive 2216 to perform under extremely frigid temperatures. Because it can withstand temperatures up to -423°F (-252°C), it is ideal for cryogenic bonding applications. At room temperature it offers a 90 minute work life to allow for repositioning and adjustments. It will slowly cure over 7 days, but can be heat cured to reduce this to as little as 30 minutes (at 200°F/93°C.) It has a bonded shear strength that can withstand up to 3,200 psi at 72°F (24°C)
- Very flexible bond is resistant to extreme shock, vibration and flexing, making it ideal for potting and applications in the transportation industries
- Maintains a strong bond under expansion, contraction, and limited movement while retaining good strength after environmental aging
- Medium viscosity help minimize running, dripping, or migration while also self-levelling
- Versatile bonding agent will adhered a wide variety of similar and dissimilar substrates, including metals and masonry
- Excellent for cryogenic bonding applications or adhering substrates that will be exposed to extreme cold
- Can be heat cured to reduce curing times from 7 days to as a little as 30 minutes
- Cryogenic bonding applications where bonded agents might experience temperature extremes
- Potting where expansion and thermal changes may occur, such as solar panels and appliance or construction applications
- Military bonding applications, for example bonding parts on movable transports
- General aerospace and transportation bonding where vibrations and movement are common
- Bonding ceramic, most plastics and glass to metal
- Attaching various substrates to masonry and stone